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PACKAGE ¿ë ÀÚµ¿¶ó¹Ì³×ÀÌÅÍ °³¹ß Ãâ½Ã |
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ÀüÀÚÁ¦Ç°¿ë ´ë¸éÀû ±Û¶ó½º ÀÚµ¿¶ó¹Ì³×ÀÌÅÍ °³¹ß Ãâ½Ã |
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UP GRADE WET LAMINATOR °³¹ß Ãâ½Ã |
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OLED OMM(Open Metal Mask)¿ë ÀÚµ¿ ³ë±¤±â °³¹ß Ãâ½Ã |
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FLIM MASK AUTO ALIGNER °³¹ß Ãâ½Ã |
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UTG (Ultra Thin Glass)¿ë ¶ó¹Ì³×ÀÌÅÍ ¹× ³ë±¤±â °³¹ß Ãâ½Ã |
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ÀüÀå¿ë ´ë¸éÀû RTR¾ç¸éµ¿½Ã ³ë±¤±â °³¹ß Ãâ½Ã |
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UP GRADE ¾ç¸éµ¿½Ã ÀÚµ¿³ë±¤±â °³¹ß Ãâ½Ã |
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¹Ú¸· ¼¼¶ó¹Í¿ë ÇÕÁöÀÚµ¿È ÀåÄ¡°³¹ß Ãâ½Ã |
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OLED OMM(Ofen Metal Mask)¿ë ¶ó¹Ì³×ÀÌÅÍ ¹× ³ë±¤±â °³¹ß Ãâ½Ã |
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Vetical type RTR³ë±¤±â °³¹ß Ãâ½Ã |
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¼¼¶ó¹Í PCB¿ë Direct Image °³¹ß ³³Ç° |
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´ë¸éÀû RTR ÀÚµ¿ ³ë±¤ Àåºñ °³¹ß |
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ÁßÀåºñ¿ë µµÀå¶óÀÎ ·Îº¿ ÀÚµ¿È |
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¿¬·áÀüÁö ÀÚµ¿È ¶óÀÎ °³¹ß |
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´ë¸éÀû UV-LED ³ë±¤±â °³¹ß (1300x3000) |
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UV LED DIRECT IMAGING MACHINE °³¹ß |
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TSP RTR GAP ÄÜÆ®·Ñ ³ë±¤±â°³¹ß Á¦ÀÛ ³³Ç°("H"»ç) |
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LDIÀåºñ ±¹³» ÃÑÆÇ SOLE AGENT °è¾àü°á(ij³ª´Ù, "A"»ç) |
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TSP AG¿ë GAP ÄÜÆ®·Ñ ³ë±¤±â°³¹ß Á¦ÀÛ ³³Ç°("D"»ç) |
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TSP ÆÐ³Î¿ë ³»,¿ÜÃþ°â¿ë ¾ç¸é µ¿½Ã ³ë±¤ÀåÄ¡ °³¹ß ³³Ç° ("T"»ç) |
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FPC¿ë RTR ¾ç¸é µ¿½Ã ³ë±¤ ÀåÄ¡ °³¹ß ¹× ³³Ç° ("B"»ç) |
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TSP¿ë RTR º¸È£Çʸ§ ¶ó¹Ì³×ÀÌÅÍ °³¹ß ¹× ³³Ç° |
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TSP¿ë DFR RTR LAMINATOR (´Ü¸é)°³¹ß ¹× ³³Ç° |
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TSP¿ë ´Ü¸é ÀÚµ¿ RTR ³ë±¤±â °³¹ß ¹× ³³Ç° |
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ºÎ¼³ ¿¬±¸¼Ò Á¤½Ä Àΰ¡ |
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PCB¿ë AUTO DFR LAMINATER »ý»ê°³½Ã |
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PCB¿ë ÀÚµ¿³ë±¤±â OEM»ý»ê°³½Ã |
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SMT In-Line ÀÇ Loader / Unloader System, ¼öÃâ°³½Ã (JAPAN)
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(ÁÖ) ÄÉÀÌ¿¤Å×Å© ÄÚÆÛ·¹À̼ÇÀ¸·Î ¹ýÀÎÀüȯ |
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