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FUB-350 Wafer to Wafer Bonding ÀåÄ¡ |
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Wafer¿¡¼ ChipÀ» ÇȾ÷ÇÏ¿© Áß°£Stage¿¡¼ ¿Ü°ü°Ë»ç ÈÄ È»óÀÎ½Ä ¹× CenteringÇÏ¿© º°µµÀÇ Wafer»ó¿¡ BondingÇÏ´Â °íÁ¤µµ Die Bonder |
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¡á Ư¡
1. 3Â÷¿ø ½ÇÀå(chip on chip)¿ë °íÁ¤µµ Bonder
2. 50§ µÎ²² Wafer´ëÀÀ
3. Chip ¿Ü°ü°Ë»ç±â±¸ ´ëÀÀ
4. Chip À§Ä¡Á¤µµ ÃøÁ¤±â±¸ ´ëÀÀ
5. Parameter ÀԷ¸¸À¸·Î °¢Á¾ Á¶°Ç¼³Á¤ÀÌ °¡´É |
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